Low-pressure injection molding

Low-Pressure Injection Molding

The mainstreaming of the low-pressure injection molding machine is a matter of the present age. Typically, it is a process that uses hot liquified polyamide and polyolefin materials. It paves the way to protect vulnerable components prone to moisture, vibration, and dust particles and makes them flame retardant and temperature resistant. It uses reduced pressure to inject plastic into the mold and usually suitable for printed circuit boards (PCBs), cable assemblies, and sensors.

Paradoxically, conventional or high-pressure molding is slightly different from low-pressure molding and suitable for the components made to endure increased pressure. Plastic is infused at high pressure and turns into more intricate structures, providing many customized solutions. However, it involves pressures and temperatures that may damage delicate components like PCBs. 

Meanwhile, when dealing with low-pressure injection molding, pressure is kept at 100PSI. Simultaneously, the temperature ranges between 180-220°C, and the melt flow time are 10 minutes for 5 grams. 

Low-Pressure Molding in Overmolding

Overmolding refers to an injection molding process that brings about a consistent amalgamation of different materials into a solitary product. In other terms, overmolding is a process wherein formerly molded parts are re-inserted to develop a new plastic layer around the component.

The process of overmoldingincludes unprotected PCBs, loading bare, and cable assemblies into a precision-crafted tool. The cavity is then filled with a suitable low-pressure molding material. Also, it helps manufacturers encapsulate delicate components according to their requirements and have a protected and sealed product.

The low-pressure injection molding process is used in overmolding and micro injection molding to protect weak components that allow gentle protection for them (electronic assemblies). It utilizes thermoplastic materials with relatively low viscosity that permits encapsulation and overmolding of sensitive and printed circuit board assemblies. 

Since the materials used in the process are entirely adhesive in nature, this process proves to be the most feasible solution to seal circuits against moisture and dust.

Benefits of Low-Pressure Injection Molding

There are certain benefits associated with the use of low-pressure injections molding processes, and some of them are given below:

1. Reduced Number of Manufacturing Steps Required

Unlike 7 to 8 steps required to get the work done in conventional injection molding, low-pressure injection molding includes only three steps:

• Filling (Molten polymer is injected into the empty cavity)
• Packing (some more amount of molten material is packed into the cavity to avoid shrinkage when material cools)
• Cooling (during cooling, material gets hardened and solidified)

Thermoplastic polyamide materials, also known as hot materials, are heated to the temperature unless they turn into liquid form and then injected into the mold to encapsulate the electronic parts. 

On the other hand, conventional injection molding includes a curing process to add safety for mold that considerably increases the cycle time; but this is not the case with low-pressure injection molding as it works on before mentioned three steps that less time. overmolding